ACRYLIC RESIN COMPOSITION FOR SEMICONDUCTOR SEALING, SEMICONDUCTOR DEVICE USING SAME, AND MANUFACTURING METHOD THEREOF

摘要

Provided is an acrylic resin composition for semiconductor sealing which has excellent solder wettability and is not prone to leave voids when cured, and which is used in a flip chip mounting in which the sealing resin is cured and an electrical connection is made simultaneously during thermocompression by means of a method of first supplying a sealing resin to the circuit substrate; also provided are a semiconductor device using the acrylic resin composition, and a manufacturing method thereof. After supplying a sealing resin to the surface of a circuit substrate (13) having electrode pads (14), by arranging the semiconductor chip (10) by matching the positions of bump electrodes (11) on the semiconductor chip (10) and the electrode pads (14) on the circuit substrate (13) and heating said semiconductor chip (10), the sealing resin is cured and the semiconductor chip (10) and the circuit substrate (13) are electrically connected simultaneously; at this time, the acrylic resin composition (30a) for semiconductor sealing is used as the aforementioned sealing resin. This acrylic resin composition is characterized by containing a thermosetting acrylic resin that is liquid at room temperature, a radical initiator of the thermosetting acrylic resin, an active agent, and an inorganic filler.