| 摘要 |
A thin film depositing apparatus includes a point evaporation source to supply deposition materials for depositing a thin film to a substrate which is upwardly arranged. Wherein, the point evaporation source is arranged under the substrate to face the substrate. A plurality of point evaporation sources are arranged on the thin film depositing apparatus. Based on the substrate, a gap between the point evaporation sources arranged to face the center of the substrate is wider than a gap between the point evaporation sources arranged to face the surroundings of the substrate. |
