| 摘要 |
The present invention relates to a multi-layer PCB manufacturing method and, more specifically, to a multi-layer PCB manufacturing method capable of solving a twist problem and improving evenness by simultaneously operating a multi-layer PCB on the same line. The multi-layer PCB manufacturing method according to the present invention includes: an arrangement process (S100) for arranging an upper sheet (100) having multiple substrates (10) stacked on the upper part of a lower sheet (200) on which multiple different substrates (10) are stacked and installing a rivet (30) around the upper sheet; a first pressing process (S200) for pressing the upper sheet (100) and the lower sheet (200) in the same condition by pressing the upper side of the upper sheet (100) which is stacked through the arrangement process (S100) with a press (50); a hole processing process (S300) for mutually separating the upper sheet (100) from the lower sheet (200) after finishing the first pressing process and processing a hole; a copper patterning process (S400) for copper-plating the upper sheet (100) and the lower sheet (200) after the hole processing process (S300) and forming a pattern (70); and a second pressing process (S500) for pressing the upper side of the upper sheet (100) with the press (50) after coating a gap between the lower sheet (200) and the upper sheet (100) with adhesive (40). [Reference numerals] (AA) Start; (BB) End; (S100) Arrangement process; (S200) First pressing process; (S210) Polishing process; (S300) Hole processing process; (S400) Copper patterning process; (S410) Etching process; (S500) Second pressing process; (S510) Pretreatment process |
