WAFER UNLOADER AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wafer unloader and a method for manufacturing a wafer capable of stably receiving a wafer with its polishing process completed from a polishing head and securely giving it to the next process. SOLUTION: An unloader 1 comprises a plane circular unloading section 2 provided by a base section 17, a wafer mounting section 18, and a washing mechanism 16. The base section 17 and the wafer mount section 18 are connected by an action-force-absorption mechanism for absorbing vertical forces, and the wafer mounter 18 vertically movable in the base of the base section 17 reduces a moment acting to a thin planar robot arm which carries the wafer to be stably absorbed by the robot arm. Since the wafer and the polishing head are washed by the washing mechanism 16, the wafer damage caused by foreign matter is reduced.