CONDUCTIVE ADHESIVE COMPOSITION, CONDUCTIVE ADHESIVE FILM, BONDING METHOD, AND CIRCUIT BOARD

摘要

[Problem] To provide: a conductive adhesive composition which is capable of improving the physical properties of an adhesive layer after curing by increasing the crosslink density thereof, while exhibiting excellent processability; and a conductive adhesive film which uses the conductive adhesive composition. [Solution] A conductive adhesive composition which is characterized by containing: (A) a bisphenol type epoxy resin that has two or more epoxy groups in each molecule and is in a solid state at room temperature; (B) a novolac epoxy resin that has two or more epoxy groups in each molecule and is in a solid state at room temperature; (C) a resin that has a carboxyl group; and (D) a conductive filler. This conductive adhesive composition is also characterized in that the resin (C) that has a carboxyl group is composed of (C-1) a carboxyl group-containing polyurethane resin and/or (C-2) a carboxyl group-containing polyacrylic resin.