Semiconductor integrated circuit design method, involves arranging first cutting area between first and second device areas, which is modified and electrically cuts first conductive line based on design rule

摘要

The designing method involves performing a pre-simulation of a semiconductor integrated circuit (S110). Designing layout of components (S130) based on results of the pre-simulation, in which the components has first and second device areas and a first conductive line that is extended across the first and second device areas. Arranging of first cutting area (S150) between the first and second device areas, which is modified and electrically cuts the first conductive line based on one design rule, that minimizes an overhead of the first conductive line created by the first cutting area. Independent claims are also included for the following: (1) a manufacturing method of semiconductor integrated circuit; and (2) a semiconductor integrated circuit.