| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure combining a power supply path with a heat dissipation (cooling) path.SOLUTION: A method for designing a structure optimally combining power supply with heat dissipation for a laminate chip from an upper surface side of the laminate chip, includes the steps of: (a) setting heat-conductive thermal via density (default) for the laminate chip; (b) setting a substrate using silicon on which a wiring layer having a predetermined thickness is formed facing the laminate chip, on the upper surface side of the laminate chip; (c) setting power supply (default) from the wiring layer of the substrate using silicon, for the laminate chip; (d) increasing and decreasing a value of the power supply (from the default); (e) increasing and decreasing a value of the set thermal via density (from the default); and (f) repeating the steps (d) and (e) until both of the value of the power supply and the value of the thermal via density reach values within a predetermined range. |
