发明名称 |
LASER BEAM MACHINING DEVICE AND LASER BEAM MACHINING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machining device which can more reliably eliminate chips such as dust generated in laser beam machining, and to provide a laser beam machining method using the laser beam machining device.SOLUTION: A laser beam machining device 1 machines a workpiece W by a laser beam. The laser beam machining device 1 includes: a laser oscillator 18 which emits a laser beam emitted to the workpiece W; a liquid jetting means 6 which has a nozzle 14 and injects a jet fluid F from the nozzle 14; an installation base 9 on which the workpiece W is installed; a head side suction means 46 which sucks a space 52 around the nozzle 14; an installation base side suction means 48 which is arranged on the installation base 9 and sucks a space in a periphery of a surface of the installation base 9 from a rear surface side; and a suction force control device 60 which controls suction force of the head side suction means 46 and the installation base side suction means 48. |
申请公布号 |
JP2013240835(A) |
申请公布日期 |
2013.12.05 |
申请号 |
JP20130186600 |
申请日期 |
2013.09.09 |
申请人 |
SUGINO MACHINE LTD |
发明人 |
MURATSUBAKI RYOJI;NAGATA YUKIAKI;TERA NOBUYUKI;OGURA TAKAHIRO |
分类号 |
B23K26/16;B23K26/10;B23K26/12;B23K26/14 |
主分类号 |
B23K26/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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