发明名称 LASER BEAM MACHINING DEVICE AND LASER BEAM MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser beam machining device which can more reliably eliminate chips such as dust generated in laser beam machining, and to provide a laser beam machining method using the laser beam machining device.SOLUTION: A laser beam machining device 1 machines a workpiece W by a laser beam. The laser beam machining device 1 includes: a laser oscillator 18 which emits a laser beam emitted to the workpiece W; a liquid jetting means 6 which has a nozzle 14 and injects a jet fluid F from the nozzle 14; an installation base 9 on which the workpiece W is installed; a head side suction means 46 which sucks a space 52 around the nozzle 14; an installation base side suction means 48 which is arranged on the installation base 9 and sucks a space in a periphery of a surface of the installation base 9 from a rear surface side; and a suction force control device 60 which controls suction force of the head side suction means 46 and the installation base side suction means 48.
申请公布号 JP2013240835(A) 申请公布日期 2013.12.05
申请号 JP20130186600 申请日期 2013.09.09
申请人 SUGINO MACHINE LTD 发明人 MURATSUBAKI RYOJI;NAGATA YUKIAKI;TERA NOBUYUKI;OGURA TAKAHIRO
分类号 B23K26/16;B23K26/10;B23K26/12;B23K26/14 主分类号 B23K26/16
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