发明名称 |
Electronic device package structure with a hydrophilic protection layer and method for fabricating the same |
摘要 |
The invention provides an electronic device package structure and method of fabrication thereof. The electronic device package structure includes a chip having an active surface and a bottom surface. A dielectric layer is disposed on the active surface of the chip. At least one trench is formed through the dielectric layer. A first protection layer covers the dielectric layer and sidewalls of the trench. A second protection layer covers the first protection layer, filling the trench. |
申请公布号 |
US8598686(B2) |
申请公布日期 |
2013.12.03 |
申请号 |
US20100891734 |
申请日期 |
2010.09.27 |
申请人 |
CHANG TAO-CHIH;LU SU-TSAI;CHANG JING-YAO;ZHAN CHAU-JIE;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHANG TAO-CHIH;LU SU-TSAI;CHANG JING-YAO;ZHAN CHAU-JIE |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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