发明名称 |
Interleaved conductor structure with offset traces |
摘要 |
An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections. |
申请公布号 |
US8598460(B2) |
申请公布日期 |
2013.12.03 |
申请号 |
US20100976821 |
申请日期 |
2010.12.22 |
申请人 |
CONTRERAS JOHN T.;NISHIYAMA NOBUMASA;ROTHENBERG EDGAR D.;ZAKAI REHAN A.;ZHANG YIDUO;HGST NETHERLANDS B.V. |
发明人 |
CONTRERAS JOHN T.;NISHIYAMA NOBUMASA;ROTHENBERG EDGAR D.;ZAKAI REHAN A.;ZHANG YIDUO |
分类号 |
H01B11/00 |
主分类号 |
H01B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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