| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of highly efficiently hardening an adhesive by minimizing thermal damage of a circumferential member due to heat expansion when hardening the adhesive by heating in manufacturing a semiconductor device in which a silicon chip is bonded onto a base material via the adhesive.SOLUTION: A method for manufacturing a semiconductor device mounts a silicon chip 30 on a base material 10 via an adhesive 20, transmits a laser beam L having an infrared wavelength through the silicon chip 30 by irradiating the laser beam L from above the silicon chip 30, and hardens the adhesive 20 by heating it directly with the transmitted laser beam L. |
