发明名称 |
PEELING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE PEELING METHOD |
摘要 |
The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.
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申请公布号 |
US2013306948(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
US201313950990 |
申请日期 |
2013.07.25 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;TAKAYAMA TORU;MARUYAMA JUNYA;GOTO YUUGO;OHNO YUMIKO |
分类号 |
H01L51/56;G02F1/136;G02F1/1368;G09F9/30;H01L21/77;H01L21/84;H01L27/12;H01L27/32;H01L29/786;H05B33/14 |
主分类号 |
H01L51/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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