发明名称 |
ELECTRONIC DEVICE HAVING LIQUID CRYSTAL POLYMER SOLDER MASK AND OUTER SEALING LAYERS, AND ASSOCIATED METHODS |
摘要 |
An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack. |
申请公布号 |
EP2664225(A1) |
申请公布日期 |
2013.11.20 |
申请号 |
EP20110808518 |
申请日期 |
2011.12.20 |
申请人 |
HARRIS CORPORATION |
发明人 |
RENDEK, LOUIS, JOSEPH, JR.;RODRIGUEZ, CASEY, PHILIP;SNYDER, STEVEN R. |
分类号 |
H05K3/34;H05K1/18;H05K3/28 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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