FLEXIBLE INTERATED CIRCUIT AND METHOD OF MANUFACTURING THE FLEXIBLE INTERATED CIRCUIT

摘要

The present invention relates to a method of manufacturing a flexible integrated circuit and, more specifically, to a method of manufacturing a flexible integrated circuit comprising a step of forming an LSN thin film layer by depositing the LSN thin film layer on the upper and lower surfaces of a substrate; a step of depositing a polycrystalline silicon thin film layer on the upper part of the LSN thin film layer deposited on the upper surface of the substrate; a step of forming a component part by patterning and etching the polycrystalline silicon thin film layer; a step of forming a via hole by etching the polycrystalline silicon thin film layer at the boundary of the component part and the LSN thin film layer deposited on the upper surface of the substrate; a step of etching the LSN thin film layer deposited on the lower surface of the substrate; a step of forming a protective layer on the upper part; a step of coating a photosensitive film on the upper part to protect the component part from a substrate etching solution; a step of etching the substrate until the lower surface of the LSN thin film layer deposited on the upper surface of the substrate is exposed by soaking the substrate in the substrate etching solution; and a step of removing the photosensitive film.