| 摘要 |
<p>Provided is a surface-mounting substrate to which electronic components are surface-mounted using a lead-free solder, and which is capable of suppressing cracking of the electronic components and cracking of junction sections caused by heat cycle stress or external stress. Electronic components (4, 5) are surface-mounting to the surface-mounting substrate (1) by using a lead-free solder, and stress-alleviating sections (11a, 11b, 16) are formed in the vicinity of the substrate junction sections of the electronic components (4, 5).</p> |
