发明名称 INTEGRATED CIRCUIT CHIP CUSTOMIZATION USING BACKSIDE ACCESS
摘要 An integrated circuit, a method for making an integrated circuit product, and methods for customizing an integrated circuit are disclosed. Integrated circuit elements including programmable elements, such as fuses, PROMs, RRAMs, MRAMs, or the like, are formed on the frontside of a substrate. Vias are formed through the substrate from its frontside to its backside to establish conduction paths to at least some of the programmable elements from the backside. A programming stimulus is applied to at least some of the vias from the backside to program at least some of the frontside programmable elements.
申请公布号 KR20130121862(A) 申请公布日期 2013.11.06
申请号 KR20137014438 申请日期 2011.11.04
申请人 QUALCOMM INCORPORATED 发明人 PERRY DANIEL W.;GU SHIQUN SAM
分类号 H01L23/48;G11C17/16;H01L21/768 主分类号 H01L23/48
代理机构 代理人
主权项
地址