| 摘要 |
The present invention provides a method for manufacturing a semiconductor package comprising through wiring which is precise and has a low defect rate in the manufacturing process. The method for manufacturing the semiconductor package, according to one embodiment of the present invention, comprises the steps of: preparing a conductive member; removing one portion of the conductive member to form a flat portion and a protruding portion, which protrudes from the flat portion; forming a sealing member for sealing the conductive member; removing a portion of the sealing member to expose the protruding portion of the conductive member through the sealing member, and forming the through wiring; forming on the through wiring a rewiring pattern layer which is electrically connected to the through wiring; mounting a semiconductor chip on the rewiring pattern layer; and forming an external connection member which is electrically connected to the through wiring. |
