发明名称 |
METHOD FOR MANUFACTURING INTERPOSER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an interposer adaptive to narrowing pitches and increasing pins of terminal connection for mounting a semiconductor chip to a semiconductor device, and a method for manufacturing the semiconductor device.SOLUTION: A method for manufacturing an interposer comprises: an arranging step of arranging a plurality of fiber members 11 at prescribed pitches P; a block body manufacturing step; a base material manufacturing step; a through hole forming step; a continuity step; a patterning step; and a multi-layers wiring layer forming step. In the arranging step, the pitch P is set so that a relation of 2D≤P<4D for a thickness D of the fiber member 11 is satisfied. |
申请公布号 |
JP2013222942(A) |
申请公布日期 |
2013.10.28 |
申请号 |
JP20120095676 |
申请日期 |
2012.04.19 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
SHIMADA OSAMU |
分类号 |
H01L23/32;H01L23/12;H05K3/46 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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