| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method capable of suppressing occurrence of a debris when an adhesive film is divided.SOLUTION: A processing method comprises the steps of: sticking an adhesive film (DAF) and an expand tape (T3) to a rear surface (W3) of a wafer (W) separated into chips; ablating the adhesive film by positioning a condensing point (L1) near a bottom surface (DAF2) of the adhesive film from the adhesive film side exposed between the chips and irradiating the adhesive film with a laser beam (L) having a wavelength absorbed by the adhesive film; and expanding the expand tape and fracturing the adhesive film using an ablated region (A1) of the adhesive film as a starting point of fracturing. The laser beam has a power density enough to ablate the adhesive film at the condensing point, and a power density enough to suppress ablation of the adhesive film on an upper surface (DAF1) of the adhesive film. |
