发明名称 CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To inexpensively provide a circuit board in which there is no problem even when a winding and a core temperatures become high without using a printed board having a special structure to the whole device, and which surely holds the winding to the printed board to improve its reliability.SOLUTION: A circuit board comprises at least a winding 2A and a core 3 forming a magnetic path of a magnetic flux interlinked to the winding 2A on a printed board 1 where a circuit is formed thereon. A through hole 11 with such a size that passes at least the core 3, is provided on the printed board, the core 3 is provided in the through hole 11, the winding 2A is made of a metal plate, connection parts 2a are provided on its both edges, a wound part of the winding 2A is held between winding holding members 4 consisting of a high temperature resin divided into an upper and lower and is fixed to the printed board 1 through the winding holding member 4.
申请公布号 JP2013219395(A) 申请公布日期 2013.10.24
申请号 JP20130153131 申请日期 2013.07.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIZUNO TAKAHIRO;YANO TAKUTO;ISHIKURA HISASHI;TAKADA ATSUTOSHI;SUGAYA YUJI;KUMAGAI TAKASHI;TASHIRO SHOJIRO
分类号 H05K1/18;H01F27/28;H01F27/30;H01F37/00;H05K1/02 主分类号 H05K1/18
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