| 摘要 |
PURPOSE: A processing method of wood boards for processing deep grooves is provided to prevent the crack generation and the adhesiveness degradation due to deep grooves, and therefore, to be able to remarkably reduce the defect rate. CONSTITUTION: A processing method of wood boards for processing deep grooves comprises a raw plate cutting step of cutting a raw plate for wood boards into wood boards with a desired size by using a computer numerical control cutter (S10); a groove processing step of forming deep grooves according to a desired intaglio and relief pattern on one side of the cut wood board by using a computer numerical control router (S20); an adhesive coating step of coating and drying aqueous urethane adhesive on the surface in which the grooves are formed (S30); and a sheet paper thermoforming/attaching step of adhering sheet paper on the surface in which the deep grooves are formed by closely attaching the sheet in which patterns are printed to the surface in which the deep grooves are formed, and pressurizing at a high temperature (S40). The adhesive coating step comprises a primary coating process of coating and drying a first aqueous urethane adhesive mixed solution on the part where the deep grooves are formed (S31); a secondary coating process of coating and drying a second aqueous urethane adhesive mixed solution on the whole surface (S32); and a finishing coating process of coating and drying a third aqueous urethane adhesive mixed solution on the whole surface (S33). [Reference numerals] (S10) Cutting a raw plate; (S20) Processing deep grooves; (S31) Primary coating process of; (S32) Secondary coating process; (S33) Finishing coating process; (S40) Heat molding/adhering sheet paper |
