发明名称 SUBSTRATE CHECKING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To precisely position a substrate even when a thinned substrate is flexed.SOLUTION: A substrate 112 is raised by plural lift pins 20, and rollers 201X, 201Y are pressed to an edge section of the substrate 112 to position the substrate 112 at a predetermined position on a stage 102. At that time, a height of the lift pins 20 near the edge section of the substrate 112 among the plural lift pins 20 is adjusted so that the edge section of the substrate 112 almost vertically contacts side faces of the rollers 201X, 201Y. This can avoid a state such that the rollers 201X, 201Y cannot press the side face of the substrate 112 due to flexion of the substrate, so as to precisely position the substrate.
申请公布号 JP2013211494(A) 申请公布日期 2013.10.10
申请号 JP20120082223 申请日期 2012.03.30
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 KINUGAWA KOHEI
分类号 H05K3/00;G01N21/958 主分类号 H05K3/00
代理机构 代理人
主权项
地址