| 摘要 |
A forging die device is configured in such a manner that die heating heater plates (11, 21) are disposed between a die (1) which is held at the outer periphery thereof by die holders (12, 22) and die holding means (14a, 24a) which comprise heat insulating plates (13, 23) and die plates (14, 24). The die holders, the die holding means, and the die plates are integrated together. After the preheated die (1) is placed on the heated die holding means, the die (1) is heated by heating means, and the forming surfaces (10a, 20a) of the die are heated to a required temperature immediately before forging. |
