| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a suspension capable of being downsized.SOLUTION: A substrate for a suspension includes a metal support substrate 1, an isolation layer, and a wiring layer 3. The wiring layer 3 includes a first wiring layer 3x to a third wiring layer 3z. On a jumper part 1b, there are provided a first via part 6x to a third via part 6z which are connected to the first wiring layer 3x to a third wiring layer 3z, respectively. The first via part 6x and the second via part 6y are connected to the jumper part 1b, and the third via part 6z is insulated from the jumper part 1b. |
