| 摘要 |
In this image pickup module, size and thickness are reduced, while removing causes of image failures and the like. In an image pickup module (1), a solid-state image pickup element (3) and a flexible substrate (2) are flip-chip bonded, and an opening (5) that is provided in the flexible substrate (2) is formed by melting the flexible substrate (2) and an anisotropic conductive film (8) adhered to the flexible substrate (2). |
