DEPOSITION APPARATUS AND DEPOSITION METHOD

摘要

An object of the present invention is to allow deposition to be performed in a desired manner by preventing a pot from approaching a base material to be treated before the deposition begins in proximity deposition and by causing the pot to approach the base metal to be treated when the deposition begins. A deposition apparatus (1) comprises a vacuum chamber (4), and a pot (5) that accommodates a deposition source (3) and is disposed in the vacuum chamber (4) so as to deposit a vaporized material from the deposition source (3) onto a base material to be treated (2). The deposition apparatus (1) comprises a gap changing device (7) that changes a gap between the base material to be treated (2) which is introduced into the vacuum chamber (4) and the pot (5).