发明名称 EMBEDDED MEMORY MODULE AND MAIN BOARD INSERTEDLY PROVIDED THEREFOR
摘要 The present invention provides an embedded memory module and a main board insertedly provided therefor, the embedded memory module comprises at least one flash memory and a controller that are installed on a circuit board with a signal transmitting connecting plug. The embedded memory module is inserted into a connecting seat of the main board by the signal transmitting connecting plug so as to transmit at least one data conforming to eMMC transfer protocol specification. Wherein the controller and the flash memories are installed on the circuit board instead of being packaged in a conventional BGA form, and the embedded memory module and the main board are connected together by a way of insertion. Thus, not only the yield rate and effect of heat dissipation of the embedded memory module may be enhanced, but also the memory capacity of the main board may be expanded readily.
申请公布号 US2013258577(A1) 申请公布日期 2013.10.03
申请号 US201313853198 申请日期 2013.03.29
申请人 INNODISK CORPORATION 发明人 WU HSI-HSI;KUO CHIN-CHUNG
分类号 G06F1/16 主分类号 G06F1/16
代理机构 代理人
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