SUBSTRATE PROCESSING DEVICE, PROCESSING DEVICE, AND METHOD FOR MANUFACTURING DEVICE

摘要

A substrate processing device is provided with: a rotational cylindrical member (DR) that has a cylindrical support surface curved at a fixed radius from a prescribed center line (AX2) and feeds a substrate (P) in the longitudinal direction of the substrate; a processing mechanism that implements prescribed processing of the substrate in specific positions (PA, EL2) on part of the substrate; a scaling member (SD) that has a scaling part (GP) that rotates around the center line along with the rotational cylindrical member and is provided marked in a ring shape to measure positional changes of the rotational cylindrical member in the circumferential direction of the support surface or positional changes of the rotational cylindrical member in the direction of the center line; and reading mechanisms (EN1, EN2) that face the scaling part and are also positioned in substantially the same directions as the specific positions when viewed from the center line and that read the scaling part.