| 摘要 |
PROBLEM TO BE SOLVED: To provide a deposition apparatus capable of depositing a resist film with uniform thickness.SOLUTION: A deposition apparatus 1 includes a coating unit 4 for coating a long substrate 60 with resist, a drying unit 5 for forming a resist film by drying the resist applied to the substrate 60, a conveyance unit 2 for conveying the substrate 60, and a correction unit 6 for correcting the substrate 60 coated with a resist liquid to such a state that both ends in the width direction, intersecting the conveyance direction of the substrate 60, are raised relatively to the central part, at least when the substrate 60 is located between the coating unit 4 and the drying unit 5. |
