| 摘要 |
PROBLEM TO BE SOLVED: To provide a test method which can test degenerated terminals when testing, by using a compression function, a semiconductor device including a plurality of semiconductor memory chips in the same package.SOLUTION: A test method is for a semiconductor device 1 which has a plurality of semiconductor memory chips 20A and 20B in a package 10, the semiconductor memory chips commonly connected to package terminals except for chip selection terminals CSA and CSB, and the test method has a function to compress input-output data and input and output the data in testing. Test data compressed and inputted from the outside of the package and written into one semiconductor memory chip is read out from the one semiconductor memory chip without compression, and written into the other semiconductor memory chip. |
