发明名称 THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A printed circuit board and a manufacturing method thereof easily form a buried pattern by removing a plating layer with chemical and physical etching. CONSTITUTION: A core insulating layer (110) includes glass fiber. A first insulating layer has a circuit pattern groove. A first circuit pattern (125) is filled in the circuit pattern groove of the first insulating layer. A second insulating layer has a circuit pattern groove on the upper surface. A second circuit pattern (135) is filled in the circuit pattern groove of the second insulating layer.
申请公布号 KR20130104506(A) 申请公布日期 2013.09.25
申请号 KR20120026044 申请日期 2012.03.14
申请人 LG INNOTEK CO., LTD. 发明人 NAM, MYOUNG HWA;LEE, SANG MYUNG;YOO, CHANG WOO;SEO, YEONG UK;KIM, BYEONG HO;SEO, HYUN SEOK
分类号 H05K3/46;H05K3/18 主分类号 H05K3/46
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