| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which is manufactured at low cost, which has resistance against stress such as deformation and resistance against weather, and which has good reliability; and provide a manufacturing method of the electronic device.SOLUTION: An electronic device 1 comprises: a glass substrate 10; internal wiring 30 provided on a top face of the glass substrate 10; an electronic component 50 mounted on the glass substrate 10 and electrically connected to the internal wiring 30; a through electrode 20 with one end being connected to the internal wiring 30; an insulation resin layer 70 formed on an undersurface of the glass substrate 10 having a uniform thickness on a position at a distance from another end of the through electrode 20; and a conductive resin layer 80 stacked so as to be connected to the insulation resin layer 70 and the other end of the through electrode 20. |
