| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing wire sweep when a resin is sealed and further suppressing failure occurrence.SOLUTION: A semiconductor device 10B comprises: a semiconductor chip 13 mounted on a die pad 12; an inner lead 14 connected via the semiconductor chip 13 and a wire 16; a dam supporting the wire 16 provided between the semiconductor chip 13 and the inner lead 14 on the die pad 12; and a hole 18b provided in a lower part of the dam, penetrating the die pad 12, and penetrating the dam in a direction along a mounting surface of the semiconductor chip 13. |
