| 摘要 |
A die bonding system for bonding a die on a substrate is provided. The die bonding system includes a supporting base for the substrate, a die pickup device for picking up the die, and an alerting device. The supporting base includes a number of conductive and height-adjustable upper portions. The upper portions are spaced from each other. The alerting device includes a power source and an alerting element electrically connected to the power source. Two electrodes of the power source are electrically connected to the die pickup device and the upper portions, and the alerting element generates different alerts according to different contacting status of the upper portions and the die pickup device. |
