发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 Terminal assembly portions, lying on a front surface side of a case, are aligned in a left-right direction in a portion raised from a bottom of the case so that opening faces of the terminal assembly portions are positioned above circuit formation regions. Wiring terminal plates are led out into the terminal assembly portions, and disposed adjacent to each other. After each wiring terminal plate is connected by a laser welding to one end of one external connection terminal plate formed integrally with a cover, these welded portions are sealed with a second mold resin portion made of gel or an insulating resin such as epoxy. By so doing, even when the terminal junction area and distance between terminal junctions in the terminal assembly portions are small, it is possible to increase the joint strength of the terminals, and also secure withstand voltage.
申请公布号 US2013234312(A1) 申请公布日期 2013.09.12
申请号 US201313788578 申请日期 2013.03.07
申请人 FUJI ELECTRIC CO., LTD 发明人 SUZUKI KENJI
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项
地址