| 摘要 |
PROBLEM TO BE SOLVED: To provide a package and power amplifier capable of avoiding characteristic degradation due to a displacement of a semiconductor element by exactly positioning the semiconductor element.SOLUTION: The package 100, used for installing a semiconductor element, includes a heat sink 112 on which the semiconductor element is placed, and a golden marking 114 which is formed on a heat sink with a surface provided with golden plating and is used as a positioning mark for the semiconductor element. |
