| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a material for thermal bonding, the material having bonding strength higher than that achieved by plating or sputtering, being easy in preservation, and facilitating patterning without using dedicated devices in each process.SOLUTION: In a material for thermal bonding between identical or dissimilar members selected from among metal members, metal microparticles are dispersed in an organic compound dispersion medium that includes 60 mass% or more of a polyol and melts or softens at a temperature of 30°C or above, the metal microparticles comprising 80-95 mass% of metal microparticles having an average particle size of primary particles in the range of 5-200 nm and 20-5 mass% of metal microparticles having an average particle size of primary particles in the range of 1-20 μm. In a method for producing the material for thermal bonding, a pasty product prepared by mixing metal microparticles into a solution obtained by dissolving an organic compound dispersion medium in an organic solvent or an aqueous solvent is poured into a mold of a flat split or the like, and then heated to evaporate the solvent. |
