发明名称 LOW TEMPERATURE DRYABLE CONDUCTIVE PASTE AND METHOD FOR SUBMINIATURE SURFACE-MOUNT DEVICES FUSE USING THE SAME
摘要 PURPOSE: A manufacturing method of a low temperature drying type conductive paste is provided to have the low temperature drying type conductive paste capable of automating the production and mass producing with maintaining electrical characteristics of the surface-mount devices (SMD) micro-fuse. CONSTITUTION: A manufacturing method of the low temperature drying type conductive paste fuse-element comprises a step of drying the mixture at low temperatures after mixing a conductive metal, a binder resin and solvent. In addition, a manufacturing method of the surface-mount devices (SMD) micro-fuse comprises a step of drying and cutting a fuse substrate which is coated with a thermosetting epoxy resin ink after spreading a conductive paste fuse-element (3) to the fuse substrate (1) by using a metal mask and spreading a thermosetting epoxy resin ink in the fuse substrate. A rated voltage range of the SMD micro-fuse which is manufactured is AC/DC 32-250 V.
申请公布号 KR20130099669(A) 申请公布日期 2013.09.06
申请号 KR20120021352 申请日期 2012.02.29
申请人 SM HI-TECH CO., LTD. 发明人 PARK, WON HYUNG;KIM, JEE HOON;IM, JAE HYEON;KIM, HYEONG NAM
分类号 H01B1/22;H01H85/04 主分类号 H01B1/22
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