| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic transducer element chip capable of detecting a crack in a substrate.SOLUTION: An element array 32 constituted of an array of ultrasonic transducer elements 33 having vibrating membranes is formed on a substrate 31. As viewed in a plan view in a thickness direction of the substrate 31, three pieces of additional wiring 41, 42 and 49 are positioned at a peripheral region 37 interposed between a contour 32a of the element array 32 and an outer edge of the substrate 31. When a break in the substrate 31 passes transversely across the three pieces of additional wiring 41, 42 and 49 in any section of the three pieces of additional wiring 41, 42 and 49, the three pieces of additional wiring 41, 42 and 49 are disconnected in the section. When a continuity check is performed, a crack in the substrate 31 is detected. |
