| 摘要 |
PROBLEM TO BE SOLVED: To provide copper foil with a carrier, wherein while adhesion between the carrier and an ultrathin copper layer is high, easy release between the carrier and the ultrathin copper layer via an intermediate layer is possible, and generation of pinholes on the surface at the ultrathin copper layer side is well controlled.SOLUTION: Copper foil with a carrier includes a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein: the intermediate layer is structured by laminating nickel or a nickel-phosphorus alloy or a nickel-cobalt alloy and chromium in this order on the copper foil carrier; coating mass of the nickel is 1,000-40,000 μg/dm, coating mass of the nickel-phosphorus alloy is 1,000-40,000 μg/dm, coating mass of the nickel-cobalt alloy is 1,000-40,000 μg/dm, and coating mass of the chromium is 10-1,000 μg/dmin the intermediate layer; and atomic concentration of chromium and atomic concentration of nickel in the surface part of the intermediate layer are controlled. |
