发明名称 |
METHOD FOR PLATING PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS USING SAME |
摘要 |
<p>The present invention relates to: a method for plating printed circuit boards which is capable of electroplating on the seed layer in order to improve electrical conductivity without having to form a lead-in wire on the front surface of the printed circuit board, which has increased productivity by not using an etching process, and which is capable of minimizing pollutant generation; and a method for manufacturing flexible printed circuit boards using same. The present invention includes the steps of: forming at least one through hole which penetrates an area where at least one circuit pattern is to be formed on a substrate; forming the seed layer on one side surface of the substrate to correspond to the circuit pattern; forming a conductive via formed in the through hole so as to be connected to the seed layer from the other side surface of the substrate, and a plating power source lead-in unit for applying a plating power source to the seed layer through the conductive via; and forming a plating layer on the seed layer by applying the plating power source to the plating power source lead-in unit.</p> |
申请公布号 |
WO2013122347(A1) |
申请公布日期 |
2013.08.22 |
申请号 |
WO2013KR00889 |
申请日期 |
2013.02.04 |
申请人 |
AMOGREENTECH CO., LTD. |
发明人 |
YU, JEONG SANG;HUR, TAE HYUN |
分类号 |
H05K3/46;H05K3/18;H05K3/40 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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