| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-dissipating resin composition that has good heat-dissipating properties and good thermal resistance, and is excellent in adhesiveness to a metal plate, graphite slab, resin-made film and the like.SOLUTION: A heat-dissipating resin composition contains a polyvinyl acetal resin (I) and an inorganic filler (II). The polyvinyl acetal resin (I) comprises, as constitutional units: a vinyl acetal unit (A); a vinyl acetate unit (B); a vinyl alcohol unit (C); and preferably a (meth)acrylic acid unit (D). Moreover 5-85 vol.% of the inorganic filler (II) is included with regard to 100 vol.% of the composition. |
