| 摘要 |
An integrated device able to simplify interconnects up to memories, able to prevent a reduction of performance due to an increase of area and longer interconnects, and able to speed up memory access. An input/output port of a processing module (21, 31, 41, 51), memory interfaces, and memory banks (221, 331, 421, 531) are connected by connection interconnects arranged in a matrix in a first direction and a second direction above an arrangement region of a plurality of memory macros. As connection interconnects, command information interconnects and data interconnects are included. The command information interconnects are formed by private interconnects, while the data interconnects are formed by private interconnects for at least the second direction interconnects. |
