发明名称 METHOD OF MANUFACTURING REFLECTION TYPE MASK FOR EUV EXPOSURE REDUCING INFLUENCE OF PHASE DEFECT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a reflection type mask for EUV exposure that reduces an influence of a phase defect by precisely grasping a position of the phase defect, which grows obliquely, and arranging an absorber pattern so that the absorber pattern covers a position at which an actual phase defect occurs.SOLUTION: A method of manufacturing a reflection type mask, which reduces an influence of a phase defect, includes the steps of: grasping an amount of positional displacement between a surface defect position, which is detected through far ultraviolet light inspection of a reflection type mask blank, and an actual phase defect position in advance; detecting a surface defect and obtaining positional information by performing surface defect inspection on the reflection type mask blank using far ultraviolet light; calculating an actual phase defect position and range from the amount of positional displacement and the positional information of the surface defect; and arranging a pattern of an absorber layer on the basis of the calculated actual phase defect position and range.
申请公布号 JP2013149875(A) 申请公布日期 2013.08.01
申请号 JP20120010577 申请日期 2012.01.23
申请人 DAINIPPON PRINTING CO LTD 发明人 ABE TSUKASA;INAZUKI YUICHI
分类号 H01L21/027;G03F1/22;G03F7/20 主分类号 H01L21/027
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