发明名称 POLYACETAL RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyacetal resin composition excellent in suppression of formaldehyde emission amount after sliding, suppression of cracks during aging and mold deposit resistance under conditions of low filling rate to the mold.SOLUTION: This polyacetal resin composition is obtained from a raw material composition including a polyacetal resin, a hydrazine derivative, a compound for lowering the melting point of the hydrazine derivative, and 2-20 times by mass of a polyalkyleneglycol to a mixture of the hydrazine derivative and the compound. The mixture of the hydrazine derivative and the compound in the composition satisfies T1<T2 and T1<T3, where in formulae, T1, T2 and T3 are apex temperatures of endothermic peaks of the mixture, the hydrazine derivative and polyacetal resin, respectively showing maximum endothermic capacities by, with DSC, heating and cooling in accordance with a predetermined temperature program, and then heating it at a predetermined rate until the mixture fuses.
申请公布号 JP2013144805(A) 申请公布日期 2013.07.25
申请号 JP20130061896 申请日期 2013.03.25
申请人 ASAHI KASEI CHEMICALS CORP 发明人 IWAMOTO TAKASHI;SASAKI YUKIYOSHI
分类号 C08L59/00;C08K5/06;C08K5/24;C08L71/02 主分类号 C08L59/00
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