发明名称 |
POLYMER THICK FILM SOLDER ALLOY CONDUCTOR COMPOSITION |
摘要 |
The invention is directed to a polymer thick film composition comprising solder alloy powder and organic medium comprising organic polymeric binder and solvent. The composition may be processed at a time and temperature necessary to remove all solvent. The invention is further directed to method(s) of electrode formation on circuits using such compositions and to articles formed from such methods and/or compositions.
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申请公布号 |
US2013187100(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
US201213668404 |
申请日期 |
2012.11.05 |
申请人 |
E I DU PONT DE NEMOURS AND COMPANY;E I DU PONT DE NEMOURS AND COMPANY |
发明人 |
DORFMAN JAY ROBERT |
分类号 |
H01B1/22;B05D5/12 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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