Structure for isolating a microstructure die from packaging stress

摘要

A microstructure device package (100) includes a package housing (104) configured and adapted to house a microstructure device (106). A bracket (102) is housed in the package housing (104). The bracket (102) includes a bracket base (108) with a first bracket arm (110) and a second bracket arm (112) each extending from the bracket base (108). A channel (114) is defined between the first and second bracket arms (110,112). The first bracket arm (110) defines a first mounting surface (116) facing inward with respect to the channel (114). The second bracket arm (112) defines a second mounting surface (118) facing outward with respect to the channel (114). The second mounting surface (118) of the bracket (102) is mounted to the package housing (104). A microstructure device (106) is mounted to the first mounting surface (116) in the channel (114). The bracket (102) is configured and adapted to isolate the microstructure device (106) from packaging stress imparted from the package housing (104) on the second mounting surface (118) of the bracket (102).