| 摘要 |
PROBLEM TO BE SOLVED: To reliably peel an epitaxy substrate after a buffer layer is irradiated with a laser beam from a rear side of the epitaxy substrate and is destroyed.SOLUTION: A laser processing device 1 comprises: a chuck table 3 that holds a transfer substrate side of a composite substrate; holding means 8 that faces the chuck table 3 and holds a side of the epitaxy substrate in the composite substrate, in which a through hole that reaches the buffer layer is formed; and transfer means 83 that relatively moves the chuck table 3 and the holding means 8 in such a direction as to come close to and depart from each other. |
