| 摘要 |
PROBLEM TO BE SOLVED: To provide interleaved wiring in a flexure for a disk device, capable of reducing width and impedance of the wiring.SOLUTION: Interleaved wiring 40A includes: first branch conductors 41a, 41b, and 41c branched from a first conductor; second branch conductors 42a and 42b branched from a second conductor; a metal base 50 having an opening 50a; an insulation layer 51 formed on the metal base 50; a first cover resin layer 61 with electric insulation properties; and a second cover resin layer 62 with electric insulation properties. The first branch conductors 41a, 41b, and 41c are formed on the insulation layer 51, and are covered with the first cover resin layer 61. The second branch conductors 42a and 42b are formed on the first cover resin layer 61, and are arranged between the first branch conductors 41a and 41b, and 41b and 41c, respectively, and also are covered with the second cover resin layer 62. |
