发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-luminance semiconductor light-emitting element.SOLUTION: A method of manufacturing a semiconductor light-emitting element includes the steps of: forming an n-side barrier layer on a semiconductor layer containing an n-type impurity including a nitride semiconductor; forming a first well layer on the n-side barrier layer; forming a first AlGaN layer on the first well layer; forming a first cap layer including the nitride semiconductor on the first AlGaN layer; forming a first barrier layer on the first cap layer at a temperature higher than that at the time of forming the first cap layer; and forming a semiconductor layer containing a p-type impurity including the nitride semiconductor on the first barrier layer. The peak wavelength λp of light emitted from a light-emitting part including the first well layer, the first AlGaN layer, the first cap layer, and the first barrier layer is longer than 515 nm.
申请公布号 JP2013141017(A) 申请公布日期 2013.07.18
申请号 JP20130057387 申请日期 2013.03.19
申请人 TOSHIBA CORP 发明人 SHIODA MICHIYA;YOSHIDA GAKUSHI;SUGIYAMA NAOJI;NUNOUE SHINYA
分类号 H01L33/06;H01L21/205;H01L33/32;H01S5/343 主分类号 H01L33/06
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